Tech-X Corporation Awarded SBIR Grant to Advance Photonic Integrated Circuit Development with XSim Tool

Tech-X Corporation is excited to announce that we have been awarded a Small Business Innovation Research (SBIR) Phase I grant. This grant allows us to push the boundaries of photonic integrated circuit (PIC) design, enhancing XSim to address real-world manufacturing challenges. By incorporating manufacturing variations into our simulations, we aim to improve the precision and speed of photonic device development.

Innovating Photonic Integrated Circuit Design

Photonic integrated circuits are critical components of next-generation computing and communication technologies. However, designers and manufacturers often face challenges due to imperfections and variations in the manufacturing process, such as non-vertical sidewalls and line edge roughness. These issues can impact the performance of photonic devices, leading to longer development times and higher costs.

At Tech-X, we are addressing these challenges by developing an enhanced signoff tool for PICs. Our XSim tool will be upgraded to account for manufacturing imperfections, allowing designers to optimize their circuits with greater accuracy and efficiency.

XSim Enhancements and Project Focus

This project is centered on upgrading XSim, a powerful tool for electromagnetic and photonic simulations. With the support of this grant, we plan to:

• Incorporate manufacturing variations, such as sidewall roughness and other fabrication defects, into XSim.
• Integrate metrology data to ensure simulations accurately reflect real-world manufacturing conditions.
• Collaborate with subrecipients to manage intellectual property, leverage foundry expertise, and streamline metrology data management.

These enhancements will help designers understand how manufacturing variations affect their designs, leading to faster prototyping and more reliable products.

Expected Benefits and Outcomes

The improvements to XSim will deliver several key benefits, including:

• Lower development costs by reducing the need for multiple design iterations.
• Faster time-to-market for photonic integrated circuits, giving U.S. manufacturers a competitive edge.
• Increased design accuracy by simulating potential defects early in the process, resulting in more reliable, high-performance PICs.

Who Stands to Benefit

The enhanced XSim tool will benefit a wide range of stakeholders, including:

• Photonic integrated circuit designers will experience faster development cycles and more reliable results.
• U.S. semiconductor manufacturers and fabrication facilities will benefit from quicker and more accurate design processes for their customers.

Tech-X: Shaping the Future of Semiconductor Manufacturing

As a proud SBIR Phase I award recipient, Tech-X is committed to driving innovation in the U.S. semiconductor and photonic sectors. With the planned enhancements to XSim, we look forward to supporting the growing demand for high-performance, cost-effective photonic integrated circuits.

We will continue to share updates as this exciting project progresses. Stay tuned for more information as we push the boundaries of photonic and semiconductor technologies.

For additional details about our simulation tools or to discuss potential collaborations, please email us at [email protected].