Tech-X News

Tech-X 2019 Worldwide Simulation Summit Agenda TWSS2019

Registration Additional time is available for independent simulation project work coached by Tech-X experts.  Contact us at sales@txcorp.com Register to attend the 2019 Tech-X Worldwide Simulation Summit. This year’s Tech-X Worldwide Simulation Summit presenters and instructors will include: John R. Cary, Tech-X Co-founder and CEO, CU Boulder Fellow Sveta Shasharina, Tech-X Co-founder and VP Computational …

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Tech-X CEO Dr. John R. Cary Selected as Senior Level Winner of 2019 IEEE NPSS PAST Award

Boulder, Colorado – July 5, 2019: Professor Cary, below, is a founder of Tech-X Corporation, a Fellow of the Center for Integrated Plasma Studies at the University of Colorado, Boulder, and an active IEEE member. The Particle Accelerator Science and Technology Technical Committee (PAST) of the IEEE Nuclear and Plasma Sciences Society awards the prestigious Particle …

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Tech-X 2017 Worldwide Simulation Summit Agenda

Agenda September 12, 2017 Tuesday Introduction to FDTD and Self-consistent PIC Algorithms VSim Visual Setup and Text-based Setup Visualization and Post-processing H5 file formats and locations September 13, 2017, Wednesday Microwave Devices Pillbox Cavity Excitation Determining Q-factor, losses, modes Plasma Discharges Plasma Simulation Performance Avoiding numerical instabilities: Debye heating Adding particles to simulations Importing cross-sections …

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Tech-X Announces NIMROD Publication

Boulder, Colorado – September 30, 2016: Tech-X Announces NIMROD Publication Tech-X announces the publication of “NIMROD modeling of quiescent H-mode: reconstruction considerations and saturation mechanism” by J.R. King and K.H. Burrell and A.M. Garofalo and R.J. Groebner and S.E. Kruger and A.Y. Pankin and P.B. Snyder.

Tech-X 2016 Worldwide Simulation Summit

Boulder, Colorado – August 26, 2016: Register at https://2016twss.eventbrite.com. TWSS 2016 Agenda TWSS 2016 features new VSim user training, training and presentations on VSim for Electromagnetics, VSim for Microwave Devices, VSim for Plasma Discharges, and VSim for Plasma Acceleration, as well as advanced VSim user training.  In addition, as in years past, Tech-X will offer …

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Tech-X to Present at ICOPS 2016 in Banff, Canada

Boulder, Colorado – April 18, 2016: June 19-23, 2016: Tech-X will exhibit at the 43rd International Conference on Plasma Science. Join Tech-X in our booth at ICOPS 2016. On the morning of June 23rd Tech-X will host a meeting presenting a VSim and USim overview, including new VSim version 8 features.