Tech-X to Present at ICOPS 2016 in Banff, Canada

Boulder, Colorado – April 18, 2016:

June 19-23, 2016: Tech-X will exhibit at the 43rd International Conference on Plasma Science.

Join Tech-X in our booth at ICOPS 2016.

On the morning of June 23rd Tech-X will host a meeting presenting a VSim and USim overview, including new VSim version 8 features.