Tech-X Corporation Online Press Kit

Name Usage

Logos and Brochure Files

Download a compressed zip file containing the Tech-X corporate logo and product logos for VORPAL, OOPIC Pro, GPULib, and FastDL.

Trademarks

OOPIC Pro, GPULib, FastDL, TaskDL, mpiDL, and Tech-X are registered trademarks of Tech-X Corporation. VORPAL is a registered trademark of the University of Colorado.

Corporate Summary

Tech-X Corporation is committed to technical excellence and innovation. Our technical staff addresses specific research questions and delivers quantifiable results, culminating in specialized skills, advanced technologies, and commercial products that enable large-scale computing solutions and offer a greater understanding of physical processes. Among our core competencies is the simulation of processes, devices, and physical systems related to plasma physics, fusion, and accelerator technologies, performed on computer systems ranging from desktops to Leadership Computing Facilities. By creating software for simulations and the infrastructure to support our research development, we are able to increase our understanding of complex physical phenomena.

Product Summary

Our products enable our customers to build a greater understanding of physical processes and, by applying this knowledge, to improve their productivity in designing and developing equipment and procedures in areas such as plasma processes in high energy physics and materials processing.

VORPAL is a highly-configurable multiphysics simulation application for modeling the interaction of matter with electromagnetic fields. Using advanced parallel algorithms enables the investigation of highly complex physical systems with unprecedented fidelity.

GPULib provides a library of mathematical functions that facilitate the use of high performance computing resources available on modern graphics processing units (GPUs) by engineers, scientists, analysts, and other technical professionals.

OOPIC Pro integrates simulation and visualization capabilities, allowing users to easily create PIC (Particle-in-Cell) simulations to solve problems in education, research, and engineering.

FastDL: To bridge the gap between IDL and parallel computing, Tech-X Corporation has developed FastDL. With FastDL, scientists and developers can run IDL visualization and analyses applications in parallel, significantly shortening the time required to get results.

Professional Services

The Tech-X Professional Services Group is comprised of researchers who can provide custom implementations for our existing products and custom solutions to solve complex scientific problems that leverage our expertise in languages and technologies.

Letter of Introduction

Download the Letter of Introduction (PDF format), which contains the above summary information.

Downloadable Press Kit

Download the entire Tech-X Press Kit as a zip archive. The contents of the kit include:

Press Inquiries

Tech-X has multiple offices and resellers around the world. Please direct press inquiries to Tech-X Marketing at our Worldwide Headquarters in Boulder, Colorado. Contact:

Ed Kase
Vice President, Marketing & Business Development
sales@txcorp.com
Tel: + 1 303 448 0727
Fax: +1 303 448 7756

Tech-X Corporation Worldwide Headquarters
5621 Arapahoe Ave. Suite A
Boulder, CO 80303